• When operating in SuperSpeed mode, full-duplex signaling occurs over 2 differential pairs separate from the non-SuperSpeed differential pair. This results in USB 3.0 cables containing 2 wires for power and ground, 2 wires for non-SuperSpeed data, and 4 wires for SuperSpeed data, and a shield (not required in previous specifications).
• To accommodate the additional pins for SuperSpeed mode, the physical form factors for USB 3.0 plugs and receptacles have been modified from those used in previous versions. Standard-A cables have extended heads where the SuperSpeed connectors extend beyond and slightly above the legacy connectors. Similarly, the Standard-A receptacle is deeper to accept these new connectors. A legacy Standard-A cable will operate as intended and will never interact with the SuperSpeed connectors, ensuring backward compatibility. The Standard-B modifications could not be made as elegantly; the SuperSpeed connectors had to be placed on top of the existing form factor, making legacy Standard-B plugs workable on SuperSpeed Standard-B receptacles, but not vice versa.
• SuperSpeed establishes a communications pipe between the host and each device, in a host-directed protocol. In contrast, USB 2.0 broadcasts packet traffic to all devices.
• USB 3.0 extends the bulk transfer type in SuperSpeed with Streams. This extension allows a host and device to create and transfer multiple streams of data through a single bulk pipe.
• New power management features include support of idle, sleep and suspend states, as well as Link-, Device-, and Function-level power management.
• The bus power spec has been increased so that a unit load is 150 mA (+50% over minimum using USB 2.0). An unconfigured device can still draw only 1 unit load, but a configured device can draw up to 6 unit loads (900 mA, an 80% increase over USB 2.0 at a registered maximum of 500 mA). Minimum device operating voltage is dropped from 4.4 V to 4 V.
• USB 3.0 does not define cable assembly lengths, except that it can be of any length as long as it meets all the requirements defined in the specification. However, electronicdesign.com estimates cables will be limited to 3 m at SuperSpeed.
• Technology is similar to a single channel (1x) of PCI Express 2.0 (5-Gbit/s). It uses 8B/10B encoding, linear feedback shift register (LFSR) scrambling for data and spread spectrum. It forces receivers to use low frequency periodic signaling (LFPS), dynamic equalization, and training sequences to ensure fast signal locking.
On October 27th, 2009 Gigabyte announced 7 new P55 chipsets motherboards that included onboard USB 3.0, SATA 6Gb/s and triple power to all USB ports.
On October 29, 2009 Asus announced the November release of their first USB 3.0 motherboard, the "P7P55D-E Premium", as well as a PCI-Express x1 add-on card for existing motherboards to provide USB 3.0 and SATA 6Gbps support
Drivers are under development for Windows 7, but support will not be included with the initial release of the operating system. The Linux kernel has supported USB 3.0 since version 2.6.31, which was released in September 2009.
At least one complete end-to-end test system for USB3 designers is now on the market.
Intel will not support USB 3 until 2011, which will slow down mainstream adoption. Current AMD roadmaps indicate, that the new southbridges released in the beginning of 2010 will not support USB 3. These delays may be due to problems in the CMOS manufacturing process, a focus to advance the Nehalem platform or a tactic by Intel to boost its upcoming Light Peak interface. Market researcher In-Stat does not predict a relevant market share of USB 3 until 2011.